No.

Parameter

Description

Vacuum Chamber

1

Ultimate Vacuum

Better than 4×10^–5 Pa (new equipment)

2

Leak Rate

6.7×10^–8 Pa·L/s

3

Working Vacuum

5×10^–4 Pa (Time from atmosphere to working vacuum <30 min) (For N²-purged glovebox-integrated systems, cold state)

4

Vacuum Retention

Pressure remains below 3 Pa after 24 hours post shutdown

5

Sample Size

300 × 300 mm

6

Sample Holder Size

360 × 360 mm

7

Evaporation Sources

4 organic + 4 metal sources

8

Compatible Materials

C60, BCP, Cu, Ag, LiF, MoO³, Al, etc.

9

Evaporation Sources Configuration

- Metal Sources: 4 water-cooled electrodes (compatible with 5cc ceramic Ta crucibles for Cu/Al).

- Organic Sources: 4 standard Knudsen cells (10cc, max. 500°C).

Performance Metrics:

- Organic (NPB standard): Deposition rate 0.5–3 Å/s (±0.1 Å/s stability), uniformity ±5% (≤300×300 mm).

- Metal (Al standard): Deposition rate 0.5–3 Å/s (±0.1 Å/s stability), uniformity ±5% (≤300×300 mm).

10

Source-to-Substrate Distance

530 mm (metal sources include extendable electrode rods, default 100 mm).

11

Mask Library

Not included (customizable upon request).

12

Thickness Probes

4 imported probes (1 probe monitors 2 sources).

13

Thickness Display

Real-time touchscreen monitoring:

 - Individual source rate/thickness/temperature (Knudsen cells).

 - Total thickness/rate (large-font display).

14

Deposition Control

Organic sources: Rate/temperature control.

Metal sources: Rate control (manual/automated).

15

Software

Process lock function for repeatability.

16

Closed Pumping

Mechanical pump isolation feature to enhance productivity.