Dual-Source Vacuum Evaporation PVD System Machine For Metal, OLEDs, Organic
Lith-QH-ZD02-High-Vacuum Multi-Material Evaporation
Technical Specifications
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No.
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Parameter
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Description
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|
1
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Ultimate Vacuum
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≤4×10⁻⁵ Pa (new equipment)
|
|
2
|
Leak Rate
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6.7×10⁻⁸ Pa·L/S
|
|
3
|
Working Vacuum
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5×10⁻⁴ Pa (Time to reach from atmosphere: <30 min, cold state with glovebox integration)
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|
4
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Pressure Holding
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≤2 Pa after 12 hours (post pump shutdown)
|
|
5
|
Sample Size
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130×130 mm (16× 25×25 mm samples; includes 2 sets)
|
|
6
|
Sample Holder Size
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146×146 mm
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|
7
|
Source-Substrate Distance
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320 mm
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|
8
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Sample Rotation
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0–30 RPM (water-cooled)
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|
9
|
Evaporation Sources
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4× metal + 4× organic sources (2 organic sources on inner/outer door, 2 metal sources on each side)
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|
10
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Substrate Lift
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Fixed (non-adjustable)
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|
11
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Chamber Access
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Manual front-opening door
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|
12
|
Thickness Probes
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4× water-cooled probes (above sources)
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|
13
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Mask Storage
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Optional
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|
14
|
Sample Loading
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Side-insertion
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|
15
|
Deposition Control
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Auto rate/power/temperature control
|
|
16
|
Pumping System
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Automated vacuum sequencing
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|
17
|
Film Uniformity
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±5% (for 100 nm films)
|
|
18
|
Safety Features
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Anti-implosion, auto gas refill, environmental thermocouple
|
Key Features
1. High-Precision Deposition Control
· Automated Rate/Power/Temperature Control: Ensures repeatable thin-film growth for research and small-scale production.
· Real-Time Thickness Monitoring (4× Probes): Enables accurate multilayer deposition with ±5% uniformity.
· Dual-Source Configuration (4 Metal + 4 Organic): Supports co-evaporation for advanced materials like perovskites and organic semiconductors.
2. Optimized for Efficiency & Stability
· Fast Pump-Down (<30 min to 5×10⁻⁴ Pa): Reduces downtime between batches, improving lab productivity.
· Low Leak Rate (6.7×10⁻⁸ Pa·L/S): Maintains ultra-high vacuum integrity for sensitive processes.
· Long-Term Pressure Holding (≤2 Pa after 12 hours): Minimizes re-pumping time for multi-step experiments.
3. User-Friendly Design
· Side-Loading & Front-Opening Chamber: Compatible with glovebox workflows, reducing contamination risks.
· Water-Cooled Sample Rotation (0–30 RPM): Enhances film homogeneity while preventing thermal damage.
· Optional Mask Storage: Enables patterned deposition for micro/nanofabrication.
4. Robust Safety Protections
· Anti-Implosion Design: Safeguards against chamber breaches during high-vacuum operation.
· Auto Gas Refill & Environmental Thermocouple: Protects samples and equipment during reactive material handling.
Application Areas
1. Advanced Optoelectronic Research
· OLEDs & Organic Electronics: Precise co-evaporation of metal-organic layers for emissive devices.
· Perovskite Solar Cells: Uniform thin-film deposition for high-efficiency photovoltaic research.
· Quantum Dots & 2D Materials: Controlled growth of nanoscale films for photonics and sensors.
2. Industrial Thin-Film Development
· Barrier Coatings: Ultra-thin encapsulation layers for flexible electronics.
· MEMS & Sensors: High-purity metal/oxide deposition for microfabrication.
· Optical Coatings: Low-defect films for lenses, mirrors, and filters.
3. Customizable for Specialized Needs
· In-Situ Monitoring Upgrades: Additional diagnostics (e.g., RHEED, quartz crystal microbalance) available.
· Multi-Source Expansion: Accommodates complex material stacks (e.g., ternary systems).
Why Choose This System?
✔ Lab-Optimized Throughput: Balances high sample capacity (16×25 mm substrates) with research-grade precision.
✔ Glovebox-Compatible: Ideal for air-sensitive materials like lithium or reactive organics.
✔ Future-Ready Design: Modular options support evolving thin-film R&D demands.