Benchtop Multi-Layer Thermal Evaporator Deposition Coating For Metals, Alloys & Dielectric Film
Lith-ZY-ZD02-Research-Grade Thin Film Deposition Equipment
System Overview
Lith-ZY-ZD02 benchtop resistive thermal evaporation coating system integrates a turbo-molecular pump vacuum assembly to achieve high-vacuum thin film deposition. Equipped with 4 evaporation sources and a precision thickness control system, it is optimized for rapid multi-layer metal/alloy deposition. Featuring a plug-and-play design, this compact instrument operates reliably in office or lab environments without specialized infrastructure, making it ideal for R&D and small-batch production.
Key Advantages
1. Portability & Flexibility
·Compact footprint with multi-environment adaptability (lab/office).
2. User-Centric Design
·One-touch operation with preloaded parameters (100+ metal deposition recipes).
·10" touchscreen for intuitive process control and real-time monitoring.
3. High-Performance Deposition
·4-source simultaneous evaporation (supports 99 layers of metals/alloys/polymers per run).
·Quartz crystal monitoring for nanometer-level thickness accuracy (±3% uniformity).
4.Premium Components
·All-aluminum chamber for efficient heat dissipation.
·Imported turbo-molecular pump (300L/s) ensures ≤6×10−5 Pa ultimate vacuum.
5.Low Maintenance
·Minimal training required; modular design simplifies servicing.
Typical Applications
· Thin-film material research (metals/dielectrics)
· Optical coatings & nanoelectronics
· Thin-film sensors & MEMS devices
· Custom alloy/polymer multilayer structures
Standard Specifications
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Component
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Details
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Chamber
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400×350×360mm (H), CNC-machined aluminum
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Vacuum System
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300L/s turbo pump + dual-stage rotary vane pump
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Vacuum Measurement
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Full-range gauge (atmosphere to UHV)
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Evaporation Sources
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4 independent thermal sources (cross-contamination-free)
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Power Supply
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DC power for multi-layer deposition
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Thickness Control
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Quartz crystal monitor + manual/auto mode switching
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Software
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Network-upgradable with remote parameter adjustment
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Optional:
· Co-evaporation kit for alloys
· 2" substrate heater (400°C max)
· Water-cooled rotating sample stage
Technical Parameters
· Ultimate Vacuum: ≤6×10−5 Pa (after bake-out)
· Leak Rate: ≤5.0×10−9 Pa·L/s
· Deposition Rate: ≥8 nm/min (varies by material)
· Thickness Uniformity: ≤3% (with planetary rotation)
Site Requirements
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Parameter
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Specification
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Dimensions
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600×720×1200mm (H)
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Weight
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85 kg
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Environment
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23±3°C, <60% RH
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Power
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AC 230V, 32A, 50Hz
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Cooling Water
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0.2MPa, 15–25°C, ≥8L/min (optional)
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Gas Supply
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99.9% N2 (optional for venting)
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Operational Workflow
· Fully automated process: Pre-programmed vacuum pumping, substrate heating, and evaporation.
· Multi-layer capability: Sequential deposition of 4 materials (up to 99 layers) with customizable thickness/time modes.
· Data export: Real-time parameter logging and remote monitoring.
Why Choose?
· Time-saving: Eliminates complex setup with industry-leading uptime.
· Precision: Combines lab-grade vacuum performance with production-level repeatability.
· Scalability: Modular options cater to evolving research needs.
Ideal for academic labs, startups, and industrial R&D requiring rapid prototyping of advanced thin films.